Periodic structures of randomly distributed Cu/Cu2O nanograins and periodic variations of cell voltage in copper electrodeposition

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	Periodic structures of randomly distributed Cu/Cu2O nanograins and periodic variations of cell voltage in copper electrodeposition
	Zhang, MZ ; Wang, M ; Zhang, Z ; Zhu, JM ; Peng, RW ; Ming, NB
刊名	ELECTROCHIMICA ACTA
	2004
卷号	49 期号:14 页码:2379
关键词	THIN-LAYER ELECTRODEPOSITION ELECTROCHEMICAL DEPOSITION POTENTIAL OSCILLATIONS FRACTAL PATTERNS GROWTH ELECTROCONVECTION NANOSTRUCTURES SUBSTRATE
ISSN号	0013-4686
通讯作者	Zhang, MZ (reprint author), Jilin Univ, Dept Mat Sci & Engn, Changchun 130025, Peoples R China.
中文摘要	Copper electrodeposition can create periodic self-assembled structures with randomly distributed Cu/Cu2O nanograins and spontaneously periodic variations of cell voltage in the presence of an ultrathin layer of concentrated CuSO4 electrolyte. The experiment was performed at -4.85 degreesC and cell currents of 30 muA. We suggest that the observed self-assembled structures and periodic variations of cell voltage are caused by a change in the cathode over-potential and the standard electrode potential for Cu2O and Cu in front of the growing interface. The mechanism of the self-assembled structure and the spontaneously periodic variations of cell voltage is discussed. (C) 2004 Elsevier Ltd. All rights reserved.
收录类别	SCI
语种	英语
公开日期	2013-09-24
内容类型	期刊论文
源URL	[http://ir.iphy.ac.cn/handle/311004/50676]
专题	物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文
推荐引用方式 GB/T 7714	Zhang, MZ,Wang, M,Zhang, Z,et al. Periodic structures of randomly distributed Cu/Cu2O nanograins and periodic variations of cell voltage in copper electrodeposition[J]. ELECTROCHIMICA ACTA,2004,49(14):2379.
APA	Zhang, MZ,Wang, M,Zhang, Z,Zhu, JM,Peng, RW,&Ming, NB.(2004).Periodic structures of randomly distributed Cu/Cu2O nanograins and periodic variations of cell voltage in copper electrodeposition.ELECTROCHIMICA ACTA,49(14),2379.
MLA	Zhang, MZ,et al."Periodic structures of randomly distributed Cu/Cu2O nanograins and periodic variations of cell voltage in copper electrodeposition".ELECTROCHIMICA ACTA 49.14(2004):2379.