Micromachining of SrTiO3 steps for high-T-c step edge junction dc SQUIDs

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	Micromachining of SrTiO3 steps for high-T-c step edge junction dc SQUIDs
	Wang, J ; Han, B ; Chen, GH ; Xu, FZ ; Yang, QS ; Cui, TH
刊名	JOURNAL OF MICROMECHANICS AND MICROENGINEERING
	2004
卷号	14 期号:1 页码:1
关键词	EPITAXIAL YBA2CU3O7 FILMS JOSEPHSON-JUNCTIONS MICROSTRUCTURE
ISSN号	0960-1317
通讯作者	Wang, J: Chinese Acad Sci, Inst Phys, Beijing 100080, Peoples R China.
中文摘要	In this paper, we establish a model of the micromachined SrTiO3 substrate steps for high-T-c direct-current (dc) superconducting quantum interference devices (SQUIDs). The step angle is determined by the local ion milling rate and re-deposition rate, which is caused by back sputtering of ion milling. At dynamic balance, the maximum possible step angle is predicted to be 75degrees with an ion beam incidence angle of 45degrees, which agrees well with the measured value of 71degrees. In order to obtain a better step sidewall profile, we consider the influences of Nb metal mask micromachining. To avoid a rounded angle at the step upper corner, the minimum thickness of the Nb mask should be 440 nm when the desired step height is 300 nm. At optimized process conditions, steps with sharp, steep angles, and flawless profiles have been fabricated. Nine of the twelve dc SQUIDs thus obtained exhibited resistively shunted junction current-voltage behavior and magnetic field modulation at 77 K.
收录类别	SCI
语种	英语
公开日期	2013-09-18
内容类型	期刊论文
源URL	[http://ir.iphy.ac.cn/handle/311004/42009]
专题	物理研究所_物理所公开发表论文_物理所公开发表论文_期刊论文
推荐引用方式 GB/T 7714	Wang, J,Han, B,Chen, GH,et al. Micromachining of SrTiO3 steps for high-T-c step edge junction dc SQUIDs[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2004,14(1):1.
APA	Wang, J,Han, B,Chen, GH,Xu, FZ,Yang, QS,&Cui, TH.(2004).Micromachining of SrTiO3 steps for high-T-c step edge junction dc SQUIDs.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,14(1),1.
MLA	Wang, J,et al."Micromachining of SrTiO3 steps for high-T-c step edge junction dc SQUIDs".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 14.1(2004):1.