Electroless Deposition of Highly Solderable Fe-Ni Films

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	Electroless Deposition of Highly Solderable Fe-Ni Films
	H. F. Zhou ; J. D. Guo ; J. K. Shang
刊名	Journal of the Electrochemical Society
	2013
卷号	160 期号:6 页码:D233-D239
关键词	nickel-phosphorus p alloys nanoparticles systems joints cu
ISSN号	0013-4651
原文出处	://WOS:000320074700059
语种	英语
公开日期	2013-12-24
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/71740]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zhou,J. D. Guo,J. K. Shang. Electroless Deposition of Highly Solderable Fe-Ni Films[J]. Journal of the Electrochemical Society,2013,160(6):D233-D239.
APA	H. F. Zhou,J. D. Guo,&J. K. Shang.(2013).Electroless Deposition of Highly Solderable Fe-Ni Films.Journal of the Electrochemical Society,160(6),D233-D239.
MLA	H. F. Zhou,et al."Electroless Deposition of Highly Solderable Fe-Ni Films".Journal of the Electrochemical Society 160.6(2013):D233-D239.