Emerging low-dimensional materials for nanoelectromechanical systems resonators
S. Y. Ban; X. C. Nie; Z. H. Lei; J. B. Yi; A. Y. Vinu; Y. Bao and Y. P. Liu
刊名Materials Research Letters
2023
卷号11期号:1页码:21-52
ISSN号2166-3831
DOI10.1080/21663831.2022.2111233
英文摘要IMPACT STATEMENT This review delineates the principles and advances of nanoelectromechanical system resonators based on low-dimensional materials, followed by promising applications, such as sensings, nano-electronics and quantum detections. Low-dimensional materials (LDMs), due to exotic mechanical, optical and electrical properties enhanced by ultrahigh surface-to-volume ratio and quantum confinements, have taken centerstage in nanoelectromechanical system (NEMS) resonators. The ability to survive from high strains and complex environments enables LDMs-based NEMS resonators innovative effectuations for mass-, gas- and bio-sensings and computings. In this review, we highlighted the fabrication, actuation, detection, figure of merit, influence factors and recent process of LDMs-based NEMS resonators. After overviewing representative applications and feasible directions, we summarized the confronted challenges in fabrications, tunings and utilizations of LDMs-based NEMS resonators. Finally, the prospects that may properly tackle these obstacles were concluded, attempting to offer useful guidelines for both theoretical and experimental experts to promote NEMS resonators one step closer toward industrializations.
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语种英语
内容类型期刊论文
源URL[http://ir.ciomp.ac.cn/handle/181722/66616]  
专题中国科学院长春光学精密机械与物理研究所
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S. Y. Ban,X. C. Nie,Z. H. Lei,et al. Emerging low-dimensional materials for nanoelectromechanical systems resonators[J]. Materials Research Letters,2023,11(1):21-52.
APA S. Y. Ban,X. C. Nie,Z. H. Lei,J. B. Yi,A. Y. Vinu,&Y. Bao and Y. P. Liu.(2023).Emerging low-dimensional materials for nanoelectromechanical systems resonators.Materials Research Letters,11(1),21-52.
MLA S. Y. Ban,et al."Emerging low-dimensional materials for nanoelectromechanical systems resonators".Materials Research Letters 11.1(2023):21-52.
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