Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates | |
Qian Jia3; Zhixing Mu2; Xingkai Zhang3; Bin Zhang3; Ruixuan Liu2; Kaixiong Gao3; Yuanlie Yu3; Zhenguo Lai3; Junyan Zhang3 | |
刊名 | Materials Today Chemistry |
2021 | |
期号 | 21页码:100521-100532 |
内容类型 | 期刊论文 |
源URL | [http://ir.licp.cn/handle/362003/29979] |
专题 | 兰州化学物理研究所_先进润滑与防护材料研究发展中心 |
通讯作者 | Bin Zhang |
作者单位 | 1.兰州理工大学石油化工学院 2.山西大学分子科学研究所晶体材料研究所 3.中国科学院兰州化学物理研究所, 材料磨损与防护科技重点实验室 |
推荐引用方式 GB/T 7714 | Qian Jia,Zhixing Mu,Xingkai Zhang,et al. Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates[J]. Materials Today Chemistry,2021(21):100521-100532. |
APA | Qian Jia.,Zhixing Mu.,Xingkai Zhang.,Bin Zhang.,Ruixuan Liu.,...&Junyan Zhang.(2021).Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates.Materials Today Chemistry(21),100521-100532. |
MLA | Qian Jia,et al."Electronic conductive and corrosion mechanisms of dual nanostructure CuCr-doped hydrogenated carbon films for SS316L bipolar plates".Materials Today Chemistry .21(2021):100521-100532. |
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