Thermal management of power electronics with liquid cooled metal foam heat sink | |
Li, Yongtong1,2; Gong, Liang2; Ding, Bin2; Xu, Minghai2; Joshi, Yogendra3 | |
刊名 | INTERNATIONAL JOURNAL OF THERMAL SCIENCES |
2021 | |
卷号 | 163 |
关键词 | Metal foam Heat sink Heat transfer Thermal management |
ISSN号 | 1290-0729 |
DOI | 10.1016/j.ijthermalsci.2020.106796 |
英文摘要 | In this paper, a combined experimental and numerical study of liquid cooled aluminum foam (AF) heat sink applicable for high power electronics cooling was conducted. AF heat sinks with porosity (0.88) and pore densities (10 PPI and 20 PPI) are fabricated and the empty channel is employed for comparison. Experimental measurements were conducted subjected to non-Darcy flow regime. Numerical analysis was based on the Brinkman-Forchheimer extended Darcy momentum model, together with the energy equations of local thermal non-equilibrium (LTNE) and local thermal equilibrium (LTE) models. The permeability and inertia coefficient of the AF samples were correlated based on the measured pressure drop. New correlations of interfacial heat transfer coefficient between water and AF solid matrix were also determined. Numerically predicted local surface temperature and temperature field distributions were presented and validated with the experimental measurements. The results reveal that the permeability decreases and the inertial coefficient increases with increasing pore density. The thermal performance of AF heat sinks is appreciably superior to the empty channel, under a given flow rate, the Nu(m) of the AF heat sink can be 1.40-1.76 times of the empty channel. Heat transfer enhancement by 20 PPI foam is inappreciable, approximately 5%, compared to that of 10 PPI. The LTNE model demonstrates more accurate for predicting the spatial temperature distributions than the LTE model. The results also indicate that the non-equilibrium heat transfer phenomenon in water-cooled AF heat sink is not pronounced, and the non-equilibrium effect is declined with increasing velocity. |
WOS研究方向 | Thermodynamics ; Engineering |
语种 | 英语 |
出版者 | ELSEVIER FRANCE-EDITIONS SCIENTIFIQUES MEDICALES ELSEVIER |
WOS记录号 | WOS:000620823600003 |
内容类型 | 期刊论文 |
源URL | [http://ir.lut.edu.cn/handle/2XXMBERH/147405] |
专题 | 石油化工学院 |
作者单位 | 1.Lanzhou Univ Technol, Sch Petrochem Engn, Lanzhou 730050, Peoples R China; 2.China Univ Petr East China, Coll New Energy, Qingdao 266580, Peoples R China; 3.Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA |
推荐引用方式 GB/T 7714 | Li, Yongtong,Gong, Liang,Ding, Bin,et al. Thermal management of power electronics with liquid cooled metal foam heat sink[J]. INTERNATIONAL JOURNAL OF THERMAL SCIENCES,2021,163. |
APA | Li, Yongtong,Gong, Liang,Ding, Bin,Xu, Minghai,&Joshi, Yogendra.(2021).Thermal management of power electronics with liquid cooled metal foam heat sink.INTERNATIONAL JOURNAL OF THERMAL SCIENCES,163. |
MLA | Li, Yongtong,et al."Thermal management of power electronics with liquid cooled metal foam heat sink".INTERNATIONAL JOURNAL OF THERMAL SCIENCES 163(2021). |
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