Effect of Substrate Surface Morphology on Thermal Spraying and Bonding Strength of Ni/Fe via Atomistic Simulation | |
Lei, Chunli1,2; Dong, Jianyong1; Yang, Shengze1; Cao, Hui1,2; Zhang, Jun1; Li, Haiyan1,2; Feng, Ruicheng1,2 | |
刊名 | Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering |
2022-03-01 | |
卷号 | 51期号:3页码:881-887 |
关键词 | Diffusion bonding Molecular dynamics Morphology Sprayed coatings Stress concentration Surface measurement Atomistic simulations Bonding strength Defect evolution matrix Molecular dynamics methods Nano thermal spraying Rough surfaces Smooth surface Stresses distribution Substrate surface morphology |
ISSN号 | 1002-185X |
英文摘要 | The molecular dynamics method was applied to simulate the effects of substrate surface morphology on nano-thermal spraying. The effects of columnar rough surface and smooth surface on cluster flattening, defect evolution of substrate, stress distribution, and the bonding strength between coating and substrate were investigated. The results show that the substrate surface morphology has a significant effect on the bonding strength of thermal spraying. The rough surface increases the actual contact area between the clusters and the matrix, improves the adhesion, causes the anchorage effect at the interface, and thereby enhances the bonding strength. In addition, the substrate surface morphology can change the stress distribution in the interface region. The columnar rough surface on the matrix weakens the stress concentration effect, decreases the critical stress, and reduces the damage to the substrate. Besides, the rough surface hinders the cluster slip and reduces the flattening ratio. Copyright © 2022, Northwest Institute for Nonferrous Metal Research. Published by Science Press. All rights reserved. |
语种 | 英语 |
出版者 | Science Press |
内容类型 | 期刊论文 |
源URL | [http://ir.lut.edu.cn/handle/2XXMBERH/158464] |
专题 | 机电工程学院 土木工程学院 |
作者单位 | 1.School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou; 730050, China; 2.Key Laboratory of Digital Manufacturing Technology and Application, Ministry of Education, Lanzhou University of Technology, Lanzhou; 730050, China |
推荐引用方式 GB/T 7714 | Lei, Chunli,Dong, Jianyong,Yang, Shengze,et al. Effect of Substrate Surface Morphology on Thermal Spraying and Bonding Strength of Ni/Fe via Atomistic Simulation[J]. Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,2022,51(3):881-887. |
APA | Lei, Chunli.,Dong, Jianyong.,Yang, Shengze.,Cao, Hui.,Zhang, Jun.,...&Feng, Ruicheng.(2022).Effect of Substrate Surface Morphology on Thermal Spraying and Bonding Strength of Ni/Fe via Atomistic Simulation.Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,51(3),881-887. |
MLA | Lei, Chunli,et al."Effect of Substrate Surface Morphology on Thermal Spraying and Bonding Strength of Ni/Fe via Atomistic Simulation".Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering 51.3(2022):881-887. |
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