Subsurface defect evolution and crystal-structure transformation of single-crystal copper in nanoscale combined machining | |
Li, Haiyan1,2,3; Shao, Zihao2,3; Feng, Ruicheng1,2,3; Qi, Yongnian2; Wu, Qin1,2,3; Lei, Chunli2,3 | |
刊名 | Philosophical Magazine |
2021 | |
卷号 | 101期号:1页码:38-58 |
关键词 | Binding energy Copper Machining Molecular dynamics Nanotechnology Single crystals Stacking faults Strain hardening Crystal structure transformation Dislocation evolution Molecular dynamics simulations Oscillation phenomenon Process of evolution Single crystal copper Stacking fault tetrahedron Stair rod dislocations |
ISSN号 | 14786435 |
DOI | 10.1080/14786435.2020.1814493 |
英文摘要 | In the paper, molecular dynamics simulation is applied to study the evolution and distribution of subsurface defects during nanoscale machining process of single-crystal copper. The chip-removal mechanism and the machined-surface-generative mechanism are examined through analysis of the dislocation evolution and atomic migration of the workpieces. The findings show that under different stresses and temperatures, the difference of the binding energy leads to a zoned phenomenon in the chip. Owing to elastic deformation, some of the dislocations could be recovered and form surface steps; moreover, the work hardening of the workpiece can be achieved on account of generation of twin boundaries, Lomer-Cottrell dislocations, and stacking fault tetrahedra (SFT) by plastic deformation. A process of evolution of an immobile dislocation group containing stair-rod dislocations into SFT is discovered, which is different from the traditional Silcox-Hirsch mechanism. Furthermore, a growth oscillation phenomenon, which corresponding stacking fault planes growth and retraction during the formation of the stable SFT, is discussed. © 2020 Informa UK Limited, trading as Taylor & Francis Group. |
WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering ; Physics |
语种 | 英语 |
出版者 | Taylor and Francis Ltd. |
WOS记录号 | WOS:000565007200001 |
内容类型 | 期刊论文 |
源URL | [http://ir.lut.edu.cn/handle/2XXMBERH/147241] |
专题 | 机电工程学院 |
作者单位 | 1.Centre for Efficiency and Performance Engineering, University of Huddersfield, Huddersfield, United Kingdom 2.School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou, China; 3.Key Laboratory of Digital Manufacturing Technology and Application, Ministry of Education, Lanzhou University of Technology, Lanzhou, China; |
推荐引用方式 GB/T 7714 | Li, Haiyan,Shao, Zihao,Feng, Ruicheng,et al. Subsurface defect evolution and crystal-structure transformation of single-crystal copper in nanoscale combined machining[J]. Philosophical Magazine,2021,101(1):38-58. |
APA | Li, Haiyan,Shao, Zihao,Feng, Ruicheng,Qi, Yongnian,Wu, Qin,&Lei, Chunli.(2021).Subsurface defect evolution and crystal-structure transformation of single-crystal copper in nanoscale combined machining.Philosophical Magazine,101(1),38-58. |
MLA | Li, Haiyan,et al."Subsurface defect evolution and crystal-structure transformation of single-crystal copper in nanoscale combined machining".Philosophical Magazine 101.1(2021):38-58. |
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