Cross-plane thermal transport in multilayer graphene nanobundles

doi:10.3969/j.issn.1001-0505.2016.05.015

CORC > 兰州理工大学 > 兰州理工大学 > 机电工程学院

	Cross-plane thermal transport in multilayer graphene nanobundles
	Liu, Chenhan 1,2; Dong, Yun 1,2,3; Chen, Weiyu 1,2; Tao, Yi 1,2; Cai, Shuang 1,2; Wei, Zhiyong 1,2; Bi, Kedong 1,2; Yang, Juekuan 1,2; Chen, Yunfei 1,2
刊名	Dongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Southeast University (Natural Science Edition)
	2016-09-20
卷号	46 期号:5 页码:987-991
关键词	Energy efficiency Graphene Heat conduction Industrial research Multilayers Quantum chemistry Quantum theory Thermal conductivity High frequency phonons Local density of state Low-frequency phonon Manufacturing process Multilayer graphene Thermal conductance Transmission function Transmission value
ISSN号	10010505
DOI	10.3969/j.issn.1001-0505.2016.05.015
英文摘要	In order to explore the effects of cross area and junction, which may be caused during the manufacturing process, on the cross-plane thermal transport of multilayer graphene nanobundles, a calculation research is conducted by using the atomic Green's function method, which can describe the phonon wave property and quantum effects on the nanoscale. The results show that the thermal conductance per unit area of multilayer graphene nanobundles is negatively dependent on the cross area and finally converges to the bulk value 100 MW/(m2·K). The reason is that the most increased parts of phonons are located in high-frequency region as the cross area increasing, while high-frequency phonons have lower transmission value at the interface than low-frequency phonons. In addition, the results of phonon local density of states and transmission function show that the junction can change the heat conduction direction and reduce heat transport efficiency, thus decreasing the cross-plane thermal conductance. © 2016, Editorial Department of Journal of Southeast University. All right reserved.
语种	中文
出版者	Southeast University
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/112950]
专题	机电工程学院
作者单位	1.School of Mechanical Engineering, Southeast University, Nanjing; 211189, China; 2.Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, Southeast University, Nanjing; 211189, China; 3.School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Liu, Chenhan,Dong, Yun,Chen, Weiyu,et al. Cross-plane thermal transport in multilayer graphene nanobundles[J]. Dongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Southeast University (Natural Science Edition),2016,46(5):987-991.
APA	Liu, Chenhan.,Dong, Yun.,Chen, Weiyu.,Tao, Yi.,Cai, Shuang.,...&Chen, Yunfei.(2016).Cross-plane thermal transport in multilayer graphene nanobundles.Dongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Southeast University (Natural Science Edition),46(5),987-991.
MLA	Liu, Chenhan,et al."Cross-plane thermal transport in multilayer graphene nanobundles".Dongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Southeast University (Natural Science Edition) 46.5(2016):987-991.