Solution treatment: A route towards enhancing tensile ductility of SiCp/6061Al composite via powder thixoforming and comparison of micromechanical strength modeling

doi:10.1016/j.msea.2017.04.090

	Solution treatment: A route towards enhancing tensile ductility of SiCp/6061Al composite via powder thixoforming and comparison of micromechanical strength modeling
	Zhang, X.Z.; Chen, T.J.
刊名	Materials Science and Engineering A
	2017-06-01
卷号	696 页码:466-477
关键词	Ductility Powder metallurgy Silicon carbide Silicon compounds Tensile properties Tensile testing Yield stress Aluminum matrix composites Interfacial bonding strength Load transfer mechanism Micro-mechanical modeling Solid solution strengthening Solution treatments Thixo-forming Ultimate tensile strength
ISSN号	09215093
DOI	10.1016/j.msea.2017.04.090
英文摘要	In this study, SiC particles (SiCp) with a mean size of 6.94 µm were well dispersed in the 10 vol% SiCp/6061Al composite prepared by powder thixoforming that combines the merits of powder metallurgy and thixoforming. The composites had evidently strengthened tensile strength while possessed a low elongation. However, a tailored solution treatment at 560 °C for 6 h can compensate the ductility loss to a large degree (169.2% increment in elongation as compared to the as-fabricated composite) besides an acceptable increment in tensile strength (20% and 67.2% increments in ultimate tensile strength and yield strength, respectively), due mainly to the improved ductile matrix and the enhanced interfacial bonding strength resulting from the disappearance of eutectic phases. According to the comparison results of the existing micromechanical strengthening models, the strength increments resulting from load transfer mechanism and solid solution strengthening contributed most to the yield strength, revealing the significance of SiCp addition and solution treatment. However, the strengthening efficiency of SiCp was largely affected by their failure fraction during tensile test and the model that was previously proposed by the authors had a better agreement with the experimental results than the other models. These results not only provided a pathway to achieve high strength SiCp/6061Al composites with enhanced ductility, but also shed light on a more reasonable model for the strength prediction of solutionized composites. © 2017 Elsevier B.V.
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
语种	英语
出版者	Elsevier Ltd
WOS记录号	WOS:000405881700053
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/114292]
专题	材料科学与工程学院
作者单位	State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Zhang, X.Z.,Chen, T.J.. Solution treatment: A route towards enhancing tensile ductility of SiCp/6061Al composite via powder thixoforming and comparison of micromechanical strength modeling[J]. Materials Science and Engineering A,2017,696:466-477.
APA	Zhang, X.Z.,&Chen, T.J..(2017).Solution treatment: A route towards enhancing tensile ductility of SiCp/6061Al composite via powder thixoforming and comparison of micromechanical strength modeling.Materials Science and Engineering A,696,466-477.
MLA	Zhang, X.Z.,et al."Solution treatment: A route towards enhancing tensile ductility of SiCp/6061Al composite via powder thixoforming and comparison of micromechanical strength modeling".Materials Science and Engineering A 696(2017):466-477.