The Evolution of Microstructure and Properties of Directional Solidification Pure Copper During Equal Channel Angular Pressing at Low Temperature

doi:10.11896/j.issn.1005-023X.2018.10.015

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	The Evolution of Microstructure and Properties of Directional Solidification Pure Copper During Equal Channel Angular Pressing at Low Temperature
	Guo, Tingbiao 1,2; Li, Qi 2; Wang, Chen 2; Zhang, Feng 2; Ding, Yutian 1,2; Jia, Zhi 1,2; Tang, Xingchang 1,2
刊名	Cailiao Daobao/Materials Review
	2018-05-25
卷号	32 期号:5 页码:1650-1654 and 1687
关键词	Carbon dioxide Copper Crystal orientation Electron scattering Extrusion Grain size and shape Hardness Microstructural evolution Microstructure Pressing (forming) Solidification Temperature Textures Electrical conductivity Fibrous structures Grain orientation Lattice distortions Micro-structure evolutions Microstructure and properties Preferred orientations Pure copper
ISSN号	1005023X
DOI	10.11896/j.issn.1005-023X.2018.10.015
英文摘要	The microstructure evolution of directional solidification structure in pure copper (99.99%) during equal channel angular pressing (ECAP) after cooling with dry ice was investigated by OM and XRD, the hardness and conductivity were tested. The results manifested that the fibrous structure with same orientation was formed in directional solidification structure in pure copper by route A and C at low temperature, and the characterization of (111) preferred orientation was remained. After deformation by route Bc, columnar crystal of directional solidification structure in pure copper was broken, and homogeneous equiaxed grains were formed, at the same time, the grain orientation tended to be random. The hardness of each route increased drastically after one pass extrusion, which was about 1.8 times in compare with hardness of original sample, with the increase of extrusion passes, the hardness increased slowly, whereas the hardness decreased slightly after four passes extrusion by route Bc. The consistency of grain orientation made the conductivity increased in the condition of low strain, however, with the increase of strain, lattice distortion caused electron scattering, which leaded to a slight decrease in conductivity. © 2018, Materials Review Magazine. All right reserved.
语种	中文
出版者	Cailiao Daobaoshe/ Materials Review
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/114088]
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
作者单位	1.Key Laboratory of Non-ferrous Metal Alloys and Processing of Ministry of Education, Lanzhou University of Technology, Lanzhou; 730050, China 2.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou; 730050, China;
推荐引用方式 GB/T 7714	Guo, Tingbiao,Li, Qi,Wang, Chen,et al. The Evolution of Microstructure and Properties of Directional Solidification Pure Copper During Equal Channel Angular Pressing at Low Temperature[J]. Cailiao Daobao/Materials Review,2018,32(5):1650-1654 and 1687.
APA	Guo, Tingbiao.,Li, Qi.,Wang, Chen.,Zhang, Feng.,Ding, Yutian.,...&Tang, Xingchang.(2018).The Evolution of Microstructure and Properties of Directional Solidification Pure Copper During Equal Channel Angular Pressing at Low Temperature.Cailiao Daobao/Materials Review,32(5),1650-1654 and 1687.
MLA	Guo, Tingbiao,et al."The Evolution of Microstructure and Properties of Directional Solidification Pure Copper During Equal Channel Angular Pressing at Low Temperature".Cailiao Daobao/Materials Review 32.5(2018):1650-1654 and 1687.