Effects of mold temperature on the microstructure and tensile properties of SiCp/2024 Al-based composites fabricated via powder thixoforming

doi:10.1016/j.matdes.2016.09.049

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	Effects of mold temperature on the microstructure and tensile properties of SiCp/2024 Al-based composites fabricated via powder thixoforming
	Li, P. B.; Chen, T. J.; Qin, H.
刊名	MATERIALS & DESIGN
	2016-12-15
卷号	112 页码:34-45
关键词	Powder thixoforming Al-based composite Tensile properties Microstructure
ISSN号	0264-1275
DOI	10.1016/j.matdes.2016.09.049
英文摘要	In this study, the effects of mold temperature on the microstructure and tensile properties of 2024 Al-based composites reinforced with SiC particles (SiCp; 10 vol.%) and fabricated via powder thixoforming were investigated. The tensile properties of the composite were dependent upon the mold temperature because it affected the secondary solidification behavior, compactness of the secondary solidified structures, dislocation density introduced by the plastic deformation that occurs during thixoforming, and recrystallization behavior. The tensile properties of the composite that was thixoformed at 350 degrees C exhibited the largest improvements, with the ultimate tensile strength (UTS) increasing by 235.4% (UTS = 379 MPa) and elongation decreasing by 31.0% (elongation = 4.0%) compared to those of the as-cast 2024 alloy. The increased UTS was ascribed to the thermal-mismatch and load-transfer strengthening mechanisms, enhanced compactness, increased dislocation density, decreased grain size, and lower concentration of the deleterious.-phase. The fracturing of the composites was caused by the cracking and debonding of the SiCp as the mold temperature increased, which in turn led to the total matrix failure. (C) 2016 Elsevier Ltd. All rights reserved.
资助项目	Basic Scientific Fund of Gansu University[G201407] ; Program for New Century Excellent Talents of the University of China[NCET-10-0023] ; Program for Hongliu Outstanding Youth of Lanzhou University of Technology[201203]
WOS研究方向	Materials Science
语种	英语
出版者	ELSEVIER SCI LTD
WOS记录号	WOS:000387279700005
状态	已发表
内容类型	期刊论文
源URL	[http://119.78.100.223/handle/2XXMBERH/33506]
专题	兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室
通讯作者	Chen, T. J.
作者单位	Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China
推荐引用方式 GB/T 7714	Li, P. B.,Chen, T. J.,Qin, H.. Effects of mold temperature on the microstructure and tensile properties of SiCp/2024 Al-based composites fabricated via powder thixoforming[J]. MATERIALS & DESIGN,2016,112:34-45.
APA	Li, P. B.,Chen, T. J.,&Qin, H..(2016).Effects of mold temperature on the microstructure and tensile properties of SiCp/2024 Al-based composites fabricated via powder thixoforming.MATERIALS & DESIGN,112,34-45.
MLA	Li, P. B.,et al."Effects of mold temperature on the microstructure and tensile properties of SiCp/2024 Al-based composites fabricated via powder thixoforming".MATERIALS & DESIGN 112(2016):34-45.