High power femtosecond semiconductor lasers based on saw-toothed master-oscillator power-amplifier system with compressed ASE
Y. J. Wang,X. Zhang,C. Z. Tong,L. J. Wang,S. L. Shu,S. C. Tian and L. J. Wang
刊名Optics Express
2020
卷号28期号:5页码:7108-7115
ISSN号1094-4087
DOI10.1364/oe.385576
英文摘要High power femtosecond semiconductor laser based on saw-toothed taper mode-locked laser and amplifier was demonstrated with compressed amplified spontaneous emission (ASE). The external-cavity mode-locked taper laser generated the clean optical pulses without any sub-pulse components. A semiconductor optical amplifier (SOA) with tilted taper waveguide and saw-toothed edge reduced evidently the ASE background. The saw-tooth microstructures were optimized and it was found that the saw-tooth of right-right angled triangle showed the best effect. The ratio of the maximum intensity to background radiation was increased by 21.9% and the power was increased by 30.5% due to the saw-tooth microstructure in the SOA. The pulse duration of 495 fs and a peak power over 1.5 kW with repetition rate of 579 MHz were realized after a double-pass grating compressor. (C) 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreement
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语种英语
内容类型期刊论文
源URL[http://ir.ciomp.ac.cn/handle/181722/64554]  
专题中国科学院长春光学精密机械与物理研究所
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Y. J. Wang,X. Zhang,C. Z. Tong,L. J. Wang,S. L. Shu,S. C. Tian and L. J. Wang. High power femtosecond semiconductor lasers based on saw-toothed master-oscillator power-amplifier system with compressed ASE[J]. Optics Express,2020,28(5):7108-7115.
APA Y. J. Wang,X. Zhang,C. Z. Tong,L. J. Wang,S. L. Shu,S. C. Tian and L. J. Wang.(2020).High power femtosecond semiconductor lasers based on saw-toothed master-oscillator power-amplifier system with compressed ASE.Optics Express,28(5),7108-7115.
MLA Y. J. Wang,X. Zhang,C. Z. Tong,L. J. Wang,S. L. Shu,S. C. Tian and L. J. Wang."High power femtosecond semiconductor lasers based on saw-toothed master-oscillator power-amplifier system with compressed ASE".Optics Express 28.5(2020):7108-7115.
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