Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II

doi:10.1016/j.electacta.2021.138466

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	Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II
	Siddiqui, Muhammad Ali 1,2,3; Ren, Ling 2; Macdonald, Digby D.4; Yang, Ke 2
刊名	ELECTROCHIMICA ACTA
	2021-08-01
卷号	386 页码:8
关键词	Ti-xCu Passivity Electrochemical Impedance Spectroscopy Mott-Schottky Point Defect Model-II
ISSN号	0013-4686
DOI	10.1016/j.electacta.2021.138466
通讯作者	Ren, Ling(lren@imr.ac.cnn) ; Macdonald, Digby D.(macdonald@berkeley.edu)
英文摘要	The effect of copper content on the passivity of Ti-xCu alloys in a phosphate-buffered saline electrolyte (pH 7.4), in the steady-state condition, was examined using potentiostatic polarization, electrochemical impedance spectroscopy, and Mott-Schottky analysis. The study demonstrates that the oxide layer forms on the Ti-xCu alloys surface have n-type semiconducting character, and the steady-state thickness of the oxide layer is observed linearly and depends on the applied potential. The study observations are in line with the predictions of the Point Defect Model (PDM-II), which provides a physiochemically realistic description of the oxide layer formation on Ti-xCu alloys. The observations reveal that the Cu additions result in a decrease in the charge transfer resistance and capacitances associated with the hydroxide and barrier layer, an increase in the donor density, and reduce the electrochemical resistance of the Ti-xCu alloys. The study also exhibits that the decrease in the steady-state current density after the initial addition of 3 wt% of Cu is attributed to the progressive substitution of copper on the cation sublattice of the film resulting in enhanced electrostatic interaction between the immobilized copper Cu-Ti(x'), and the mobile cation interstitials Cu-i(+) , which carries the excess current over and that conveyed by oxygen vacancies V-o(center dot center dot) in the barrier layer. Moreover, it is also observed that over a hundred-year implant period, about 0.006 cm (0.06 mm) of Ti-3Cu alloy is predicted to lose due to steady-state corrosion in the PBS solution under the given set of conditions, it is further seen that, as the Cu amount increased from 3 wt% to 5 wt% in the Ti-xCu alloys, the steady-state corrosion rate decreases. (C) 2021 Elsevier Ltd. All rights reserved.
资助项目	National Natural Science Foundation[51631009] ; National Key Research and Development Program of China[2018YFC1106601] ; National Key Research and Development Program of China[2016YFC110 0600] ; Youth Innovation Promotion Association, CAS[2014168] ; Promoting Liaoning Province Talents Program -Top Young Talents, China[XLYC1807069] ; FUTURE (Fundamental Understanding of Transport Under Reactor Extremes), an Energy Frontier Research Center - U.S. Department of Energy (DOE), Office of Science, Basic Energy Sciences (BES) ; CSC scholarship
WOS研究方向	Electrochemistry
语种	英语
出版者	PERGAMON-ELSEVIER SCIENCE LTD
WOS记录号	WOS:000654682900001
资助机构	National Natural Science Foundation ; National Key Research and Development Program of China ; Youth Innovation Promotion Association, CAS ; Promoting Liaoning Province Talents Program -Top Young Talents, China ; FUTURE (Fundamental Understanding of Transport Under Reactor Extremes), an Energy Frontier Research Center - U.S. Department of Energy (DOE), Office of Science, Basic Energy Sciences (BES) ; CSC scholarship
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/160321]
专题	金属研究所_中国科学院金属研究所
通讯作者	Ren, Ling; Macdonald, Digby D.
作者单位	1.NED Univ Engn & Technol, Dept Met Engn, Univ Rd, Karachi 75270, Pakistan 2.Chinese Acad Sci, Inst Met Res, Shi Changxu Innovat Ctr Adv Mat, 72 Wenhua Rd, Shenyang 110016, Peoples R China 3.Univ Sci & Technol China, Sch Mat Sci & Engn, 96 Jinzhai Rd, Hefei 230026, Peoples R China 4.Univ Calif Berkeley, Dept Nucl Engn, Berkeley, CA 94720 USA
推荐引用方式 GB/T 7714	Siddiqui, Muhammad Ali,Ren, Ling,Macdonald, Digby D.,et al. Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II[J]. ELECTROCHIMICA ACTA,2021,386:8.
APA	Siddiqui, Muhammad Ali,Ren, Ling,Macdonald, Digby D.,&Yang, Ke.(2021).Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II.ELECTROCHIMICA ACTA,386,8.
MLA	Siddiqui, Muhammad Ali,et al."Effect of Cu on the passivity of Ti-xCu (x=0, 3 and 5 wt% ) alloy in phosphate-buffered saline solution within the framework of PDM-II".ELECTROCHIMICA ACTA 386(2021):8.