Research on motion compensation for airborne SAR interferometry system

CORC > 沈阳自动化研究所 > 中国科学院沈阳自动化研究所 > 智能检测与装备研究室

	Research on motion compensation for airborne SAR interferometry system
	Gao Y(高扬); Du JS(杜劲松); Liu YY(刘意杨); Bi X(毕欣)
	2013
会议名称	2nd International Conference on Applied Materials and Electronics Engineering, AMEE 2013
会议日期	April 19-20, 2013
会议地点	Hong Kong, China
关键词	Electronics engineering Errors Geodetic satellites Interferometry Motion compensation
页码	414-419
中文摘要	Deviation from definitive flight path of a plane fixed a synthetic aperture radar (SAR) leads to inaccurate and defocused radar images, which has serious effect on the SAR interferometry (InSAR) processing. Therefore, the precise motion compensation (MOCO) for the airborne SAR interferometric data is the key to obtain high quality digital elevation model (DEM).The position and orientation system (POS)-based residual motion error compensation method is designed. Considering the precision of POS, there will be residual motion error after the POS-based MOCO, which have serious effect on the interferometric phase, especially the residual baseline errors. To solve the above problem, this paper proposed an enhanced multi-squint processing based model to estimate the residual baseline errors. This method can decrease the influence of data decorrelation and baseline error varying with range, and dramatically improve the measuring accuracy of InSAR.
收录类别	EI ; CPCI（ISTP）
产权排序	1
会议主办者	International Science and Engineering Research Center; International Association for Scientific and High Technology
会议录	Advanced Materials Research
会议录出版者	Trans Tech Publications Ltd
会议录出版地	Zurich-Durnten, Switzerland
语种	英语
ISSN号	1022-6680
ISBN号	978-3-03785-668-0
WOS记录号	WOS:000323014600086
内容类型	会议论文
源URL	[http://ir.sia.cn/handle/173321/12399]
专题	沈阳自动化研究所_智能检测与装备研究室
推荐引用方式 GB/T 7714	Gao Y,Du JS,Liu YY,et al. Research on motion compensation for airborne SAR interferometry system[C]. 见:2nd International Conference on Applied Materials and Electronics Engineering, AMEE 2013. Hong Kong, China. April 19-20, 2013.