Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate

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	Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate
	Wang Jing 1; Liu Gui-Chang 2; Li Hong-Ling 1; Hou Bao-Rong 1
刊名	ACTA PHYSICA SINICA
	2012-03-01
卷号	61 期号:5 页码:58102
关键词	copper substrate diamond-like carbon graded intermediate layer thermal conductivity
ISSN号	1000-3290
通讯作者	Wang, J (reprint author), Chinese Acad Sci, Inst Oceanol, Key Lab Oratory Corros Sci, Qingdao 266071, Peoples R China.
英文摘要	In recent years, with the rapid development of electronic technology and digital network information, copper has increasing applications in micro-electronics, micro-electro-mechanical systems and Hi-tech materials. However copper has its material limitations. In particular, it has relatively low hardness, high oxidation and wear rate, which have severely restricted its widespread applications. In this paper, aiming at difficulties of copper applications, Ti/TiC/DLC has been proposed as functionally graded material to deposit on the copper substrate with plasma depositing method, which intensifies the adhesion between DLC film and copper substrate and improves the properties of copper. The maximal value of thermal conductivity of DLC film with optimized parameter of graded intermediate layer is 3.63 Wm(-1).K-1, which enhances the heat transfer effect of copper substrate.
学科主题	Physics, Multidisciplinary
收录类别	SCI
语种	英语
WOS记录号	WOS:000303170800068
公开日期	2013-09-24
内容类型	期刊论文
源URL	[http://ir.qdio.ac.cn/handle/337002/12482]
专题	海洋研究所_海洋腐蚀与防护研究发展中心
作者单位	1.Chinese Acad Sci, Inst Oceanol, Key Lab Oratory Corros Sci, Qingdao 266071, Peoples R China 2.Dalian Univ Technol, Sch Chem Engn, Fac Chem Environm & Biol Sci & Technol, Dalian 116024, Peoples R China
推荐引用方式 GB/T 7714	Wang Jing,Liu Gui-Chang,Li Hong-Ling,et al. Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate[J]. ACTA PHYSICA SINICA,2012,61(5):58102.
APA	Wang Jing,Liu Gui-Chang,Li Hong-Ling,&Hou Bao-Rong.(2012).Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate.ACTA PHYSICA SINICA,61(5),58102.
MLA	Wang Jing,et al."Study on the thermal conductivity of diamond-like carbon functionally graded material on copper substrate".ACTA PHYSICA SINICA 61.5(2012):58102.