Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics

doi:10.1088/1361-6528/ab5fed

CORC > 金属研究所 > 中国科学院金属研究所

	Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics
	Wang, Xin 4; Huang, Feirong 4; Wang, Dongxing 1; Li, Da 2; Li, Pu 3; Muhammad, Javid 4; Dong, Xinglong 4; Zhang, Zhidong 2
刊名	NANOTECHNOLOGY
	2020-03-27
卷号	31 期号:13 页码:9
关键词	DC arc-discharge method bimetallic nanoparticles printed electronics thermal stability resistivity
ISSN号	0957-4484
DOI	10.1088/1361-6528/ab5fed
通讯作者	Dong, Xinglong(dongxl@dlut.edu.cn)
英文摘要	In this work, Ag-Cu and Ag-Sn nanoparticles (NPs) were synthesized by a physical vapor condensation method, i.e. DC arc-discharge plasma. The as-prepared bimetallic NPs consist of metallic cores of Ag-Cu or Ag-Sn and ultrathin oxide shells of CuO or a hybrid of SnO and SnO2. Ag-Sn NPs exhibit a room-temperature resistivity of 4.24 x 10(-5) omega cm, a little lower than 7.10 x 10(-5) omega cm of Ag-Cu NPs. Both bimetallic NPs demonstrate typical metallic conduction behavior with a positive temperature coefficient of resistance over 25-300 K. Ag-Sn NPs exhibit thermally competitive stability up to 230 degrees C and a lower resistivity of 3.18 x 10(-5) omega cm after sintering at 200 degrees C, giving it potential for application in flexible printed electronics.
资助项目	National Natural Science Foundation of China[51331006] ; National Natural Science Foundation of China[51271044]
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Physics
语种	英语
出版者	IOP PUBLISHING LTD
WOS记录号	WOS:000520169000001
资助机构	National Natural Science Foundation of China
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/137634]
专题	金属研究所_中国科学院金属研究所
通讯作者	Dong, Xinglong
作者单位	1.Ningbo Univ Technol, Inst Mat, Ningbo 315016, Peoples R China 2.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Int Ctr Mat Phys, Shenyang 110016, Peoples R China 3.China United Test & Certificat Co LTD, Gen Res Inst Nonferrous Met, Beijing 100088, Peoples R China 4.Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Mat Modificat Laser Ion & Elect Beams, Minist Educ, Dalian 116023, Peoples R China
推荐引用方式 GB/T 7714	Wang, Xin,Huang, Feirong,Wang, Dongxing,et al. Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics[J]. NANOTECHNOLOGY,2020,31(13):9.
APA	Wang, Xin.,Huang, Feirong.,Wang, Dongxing.,Li, Da.,Li, Pu.,...&Zhang, Zhidong.(2020).Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics.NANOTECHNOLOGY,31(13),9.
MLA	Wang, Xin,et al."Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics".NANOTECHNOLOGY 31.13(2020):9.