Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging

doi:10.1007/s11664-019-07909-w

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	Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging
	Tian, Feifei 2,3; Pang, Xueyong 1; Xu, Bo 2; Liu, Zhi-Quan 3,4
刊名	JOURNAL OF ELECTRONIC MATERIALS
	2020-01-02
卷号	49 期号:4 页码:9
关键词	In-48Sn solder polycrystalline Cu Cu-2(In Sn) growth orientation
ISSN号	0361-5235
DOI	10.1007/s11664-019-07909-w
通讯作者	Liu, Zhi-Quan(zqliu@siat.ac.cn)
英文摘要	Evolution of Cu-2(In,Sn) formed between In-48Sn solder and polycrystalline Cu during long-time liquid-state aging was systematically investigated. During aging at 160 degrees C up to 90 min, one IMC species, Cu-2(In,Sn) was found, which showed two different morphologies, a coarse-grained Cu-2(In,Sn) sublayer and a fine-grained Cu2(In,Sn) sublayer. The fine Cu-2(In,Sn) grains had and always kept a granular morphology without any growth orientation. The morphology of coarse Cu-2(In,Sn) grains evolved from poly-facet pyramidal-type without preferential orientation into hexagonal structure preferring only one elongated direction after aging up to 90 min. Electron beam backscattered diffraction revealed that coarse-grain Cu-2(In,Sn) compound grew along [0001] axis and exposed {11-20} crystal planes. Growth mechanism of coarse Cu-2(In,Sn) grains related closely to thermodynamic stability of hexagonal structure, which drove by reduction of surface energy from higher to lower, and first principles calculations verified that {11-20} crystal planes had the lowest surface energy. Fine Cu-2(In,Sn) grains had a special growth mechanism at the root of coarse Cu-2(In,Sn) grains compared to normal fine Cu-2(In,Sn) grains underneath coarse Cu-2(In,Sn) grains.
资助项目	National Key R&D Program of China[2017YFB0305700] ; fundamental research funds for the Central Universities[N160208001]
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	SPRINGER
WOS记录号	WOS:000505344800016
资助机构	National Key R&D Program of China ; fundamental research funds for the Central Universities
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/136508]
专题	金属研究所_中国科学院金属研究所
通讯作者	Liu, Zhi-Quan
作者单位	1.Northeastern Univ, Sch Mat Sci & Engn, Shenyang 110819, Liaoning, Peoples R China 2.Nanjing Elect Devices Inst, Nanjing 210016, Jiangsu, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 4.Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Guangdong, Peoples R China
推荐引用方式 GB/T 7714	Tian, Feifei,Pang, Xueyong,Xu, Bo,et al. Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging[J]. JOURNAL OF ELECTRONIC MATERIALS,2020,49(4):9.
APA	Tian, Feifei,Pang, Xueyong,Xu, Bo,&Liu, Zhi-Quan.(2020).Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging.JOURNAL OF ELECTRONIC MATERIALS,49(4),9.
MLA	Tian, Feifei,et al."Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging".JOURNAL OF ELECTRONIC MATERIALS 49.4(2020):9.