CORC  > 金属研究所  > 中国科学院金属研究所
Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation
Zhu, Y. K.1; Chen, Q. Y.2; Wang, Q.1; Yu, H. Y.2; Li, R.2; Hou, J. P.1; Zhang, Z. J.1; Zhang, G. P.1; Zhang, Z. F.1
刊名JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
2018-07-01
卷号34期号:7页码:1214-1221
关键词Commercially pure aluminum wire Cold drawing Texture Finite element simulation Stress profile
ISSN号1005-0302
DOI10.1016/j.jmst.2017.07.011
通讯作者Wang, Q.(gmwang@imr.ac.cn)
英文摘要The evolution of microstructure in the drawing process of commercially pure aluminum wire (CPAW) does not only depend on the nature of materials, but also on the stress profile. In this study, the effect of stress profile on the texture evolution of the CPAW was systematically investigated by combining the numerical simulation and the microstructure observation. The results show that the tensile stress at the wire center promotes the formation of <111> texture, whereas the shear stress nearby the rim makes little contribution to the texture formation. Therefore, the <111> texture at the wire center is stronger than that in the surface layer, which also results in a higher microhardness at the center of the CPAW under axial loading. (C) 2017 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
资助项目State Grid Corporation of China[52110416001z] ; National Natural Science Foundation of China[51331007]
WOS研究方向Materials Science ; Metallurgy & Metallurgical Engineering
语种英语
出版者JOURNAL MATER SCI TECHNOL
WOS记录号WOS:000434132800019
资助机构State Grid Corporation of China ; National Natural Science Foundation of China
内容类型期刊论文
源URL[http://ir.imr.ac.cn/handle/321006/128176]  
专题金属研究所_中国科学院金属研究所
通讯作者Wang, Q.
作者单位1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China
2.Zhejiang Huadian Equipment Testing Inst, Natl Qual Supervis & Inspect Ctr Elect Equipment, Hangzhou 310015, Zhejiang, Peoples R China
推荐引用方式
GB/T 7714
Zhu, Y. K.,Chen, Q. Y.,Wang, Q.,et al. Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2018,34(7):1214-1221.
APA Zhu, Y. K..,Chen, Q. Y..,Wang, Q..,Yu, H. Y..,Li, R..,...&Zhang, Z. F..(2018).Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,34(7),1214-1221.
MLA Zhu, Y. K.,et al."Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 34.7(2018):1214-1221.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace