Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors

doi:10.11900/0412.1961.2017.00371

CORC > 金属研究所 > 中国科学院金属研究所

	Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors
	Zhang Guangping 2; Chen Honglei 1,2; Luo Xuemei 2; Zhang Bin 3
刊名	ACTA METALLURGICA SINICA
	2018-03-11
卷号	54 期号:3 页码:357-366
关键词	thin metal film interconnect alternating current thermal fatigue size effect
ISSN号	0412-1961
DOI	10.11900/0412.1961.2017.00371
通讯作者	Zhang Guangping(gpzhang@imr.ac.cn)
英文摘要	The world has gradually entered the industrial 4.0 Era, which is dominated by the Internet of Things (IOT) and intelligent manufacturing. Especially, strong requirement for artificial intelligence and big data processing, the development and preparation of micro/nano electronic devices is becoming increasingly active, and much more concerns have been attracted to small-scale materials. Because of the constraint effect of geometric and microstructural dimensions of these materials, the thermal fatigue damage behavior is different from that of the bulk counterparts. At the same time, the change of the material scale from microns to nanometers also results in the transformation of the deformation mechanism, so that the materials exhibit different damage behaviors and significant size effects. In this paper, thermal fatigue testing methods, thermal fatigue damage and evolution, and the factors influencing thermal fatigue properties of metal film/line are reviewed, the corresponding mechanism of thermal fatigue and the size effect of the micro/nano-scale metals are discussed. The prospective research of this field in the future is addressed.
资助项目	National Natural Science Foundation of China[51371047] ; National Natural Science Foundation of China[51671050] ; National Natural Science Foundation of China[51601198]
WOS研究方向	Metallurgy & Metallurgical Engineering
语种	英语
出版者	SCIENCE PRESS
WOS记录号	WOS:000427121400001
资助机构	National Natural Science Foundation of China
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/127495]
专题	金属研究所_中国科学院金属研究所
通讯作者	Zhang Guangping
作者单位	1.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China 3.Northeastern Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Anisotropy & Texture Mat, Shenyang 110819, Liaoning, Peoples R China
推荐引用方式 GB/T 7714	Zhang Guangping,Chen Honglei,Luo Xuemei,et al. Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors[J]. ACTA METALLURGICA SINICA,2018,54(3):357-366.
APA	Zhang Guangping,Chen Honglei,Luo Xuemei,&Zhang Bin.(2018).Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors.ACTA METALLURGICA SINICA,54(3),357-366.
MLA	Zhang Guangping,et al."Progress in Thermal Fatigue of Micro/Nano-Scale Metal Conductors".ACTA METALLURGICA SINICA 54.3(2018):357-366.