Stresses and microstructural development of thermal barrier coatings using AIP/D-gun two-step processing

doi:10.1111/j.1551-2916.2007.01496.x

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	Stresses and microstructural development of thermal barrier coatings using AIP/D-gun two-step processing
	Ke, Peiling; Wang, Qimin; Hua, Weigang; Gong, Jun; Sun, Chao; Zhou, Yanchun
刊名	JOURNAL OF THE AMERICAN CERAMIC SOCIETY
	2007-03-01
卷号	90 期号:3 页码:936-941
ISSN号	0002-7820
DOI	10.1111/j.1551-2916.2007.01496.x
通讯作者	Sun, Chao(csun@imr.ac.cn)
英文摘要	After depositing a Ni-32Co-20Cr-8Al-0.5Y-1Si-0.03B (wt%) bond coat on a Ni-base superalloy using arc ion plating (AIP), a ceramic top coat with hollow spherical powder of ZrO2-8 wt%Y2O3 (HSP-YSZ) was deposited using detonation gun (D-gun) spraying. Thermal exposure behaviors of thermal barrier coatings (TBCs) were investigated at 1100 degrees C. The thermal growth oxides (TGO) layer thickened and became more undulated during thermal exposure. Yttrium aluminum garnet (YAG) was observed within TGO, which produced thickness imperfections and thus aided to build up out-of-plane stresses. As a result, radial cracks initiated at the defects around TGO imperfections and separation developed through crack nucleation, propagation, and coalescence at the weaker TGO/bond coat interface. With further thermal exposure, coalescence of interfacial separations created a connected crack. The TBC detached and final failure occurred at the TGO/bond coat interface, leading to spallation of TBC when cooling to ambient. The stress distributions in the TGO layer with different thermal exposure times were also measured using luminescence spectroscopy. The stresses were independent of time after a transient period from theta-Al2O3 to alpha-Al2O3 scale. It is suggested that the lifetime of AIP/D-gun TBCs with an HSP-YSZ coat is controlled by the initiation and linking of a sub-critical interfacial crack.
WOS研究方向	Materials Science
语种	英语
出版者	BLACKWELL PUBLISHING
WOS记录号	WOS:000244720100041
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/92443]
专题	金属研究所_中国科学院金属研究所
通讯作者	Sun, Chao
作者单位	Chinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Ke, Peiling,Wang, Qimin,Hua, Weigang,et al. Stresses and microstructural development of thermal barrier coatings using AIP/D-gun two-step processing[J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY,2007,90(3):936-941.
APA	Ke, Peiling,Wang, Qimin,Hua, Weigang,Gong, Jun,Sun, Chao,&Zhou, Yanchun.(2007).Stresses and microstructural development of thermal barrier coatings using AIP/D-gun two-step processing.JOURNAL OF THE AMERICAN CERAMIC SOCIETY,90(3),936-941.
MLA	Ke, Peiling,et al."Stresses and microstructural development of thermal barrier coatings using AIP/D-gun two-step processing".JOURNAL OF THE AMERICAN CERAMIC SOCIETY 90.3(2007):936-941.