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	Packaging Device for Matrix-Arrayed Semiconductor Light-Emitting Elements of High Power and High Directivity
	WU, CHENG JU; CHEN, HUNG-CHE; WU, I HAN; LIU, SHANG-CHENG; PAN, JIN SHAN
	2013-03-07
著作权人	TRUELIGHT CORPORATION
专利号	US20130056759A1
国家	美国
文献子类	发明申请
其他题名	Packaging Device for Matrix-Arrayed Semiconductor Light-Emitting Elements of High Power and High Directivity
英文摘要	A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
公开日期	2013-03-07
申请日期	2012-10-23
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/90970]
专题	半导体激光器专利数据库
作者单位	TRUELIGHT CORPORATION
推荐引用方式 GB/T 7714	WU, CHENG JU,CHEN, HUNG-CHE,WU, I HAN,et al. Packaging Device for Matrix-Arrayed Semiconductor Light-Emitting Elements of High Power and High Directivity. US20130056759A1. 2013-03-07.

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