Submount for semiconductor laser element | |
USUKI TOSHIO | |
1992-12-07 | |
著作权人 | MITSUBISHI ELECTRIC CORP |
专利号 | JP1992352377A |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Submount for semiconductor laser element |
英文摘要 | PURPOSE:To prevent a die-bonded solder from coming into contact with a junction part including an active region and blocking off a laser beam when a J/D is assembled in order to obtain a low heat resistance and a low drooping characteristic. CONSTITUTION:The face of a submount 3, on which a semiconductor laser chip 1 is mounted, is formed to be recessed and protruding shapes. It is possible to prevent an excess solder from flowing to recessed parts in the submount, coming into contact with a junction part in the semiconductor laser chip and blocking off a laser beam. |
公开日期 | 1992-12-07 |
申请日期 | 1991-05-29 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/83460] |
专题 | 半导体激光器专利数据库 |
作者单位 | MITSUBISHI ELECTRIC CORP |
推荐引用方式 GB/T 7714 | USUKI TOSHIO. Submount for semiconductor laser element. JP1992352377A. 1992-12-07. |
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