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	Manufacture of semiconductor laser element
	SUMITOMO KENJI
	1987-10-02
著作权人	HITACHI LTD
专利号	JP1987224096A
国家	日本
文献子类	发明申请
其他题名	Manufacture of semiconductor laser element
英文摘要	PURPOSE:To prevent the generation of damage, such as contamination, breaking, etc. of a chip by applying voltage to surface and back electrodes for a strip body, inspecting the luminescent characteristics of each optical waveguide and parting the strip body by a groove section for parting. CONSTITUTION:A strip body 14 is formed through cleavage along the line cleavage 21 of a crystal orthogonal to optical waveguides Desired voltage is applied among anode electrodes 11 and a cathode electrode 13 for the strip body 14, and laser beams 15 emitted from the optical waveguide 1 are detected, thus inspecting luminescent characteristics. The strip body 14 is parted by a groove 12 section for desired parting, and a chip section decided to be a defective by the inspection of characteristics is selected by the parting and removed. However, parting is conducted by parting in the groove 12 sections for each parting or parting, etc. in the grooves 12 for parting at every other groove at that time. Accordingly, the number of handling of a work is decreased, thus reducing the contamination and damage of the laser chips resulting from handling.
公开日期	1987-10-02
申请日期	1986-03-26
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/83308]
专题	半导体激光器专利数据库
作者单位	HITACHI LTD
推荐引用方式 GB/T 7714	SUMITOMO KENJI. Manufacture of semiconductor laser element. JP1987224096A. 1987-10-02.

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