A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis

doi:10.1039/c8ay02642d

CORC > 合肥物质科学研究院 > 中国科学院合肥物质科学研究院 > 中科院固体物理研究所

	A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis
	Chang, Yongjia 1,2; You, Hui 1
刊名	ANALYTICAL METHODS
	2019-03-07
卷号	11 期号:9 页码:1229-1236
ISSN号	1759-9660
DOI	10.1039/c8ay02642d
通讯作者	You, Hui(usmlhy@iim.ac.cn)
英文摘要	In the development of microfluidics, integration of different materials is becoming critical, especially when the integration of fluidic and electronic components is needed. In this work, a hybrid adhesive bonding method combining adhesive and thermal bonding is proposed. It uses a pressure sensitive adhesive (PSA) tape for integration of a polymethyl methacrylate (PMMA) film and printed circuit board (PCB) substrate while a PMMA microchannel layer is bonded with PMMA film through thermal bonding. The simple bonding process can reliably integrate electronic circuits and fluidic components without any expensive equipment. The relationship between pressure applied during adhesive bonding and the bond ratio is investigated as well as the influence of pressure upon the remaining channel depth during thermocompression. The bond strength is also studied with a dead-end channel test and flow rate test ranging from 20 mu l min(-1) to 500 mu l min(-1). The results demonstrate a strong bond formed between the two different layers using the hybrid technique. As an application, a microchip for electrophoresis detection is tested. Successful separation of different ions and a comparable level of the relative standard deviation (RSD) for the migration time and the peak height imply the reliability of the bonding protocol and the good potential for a wide range of applications in the future.
资助项目	Strategic Priority Research Program of the Chinese Academy of Sciences[XDA08040109]
WOS关键词	MICROFLUIDIC DEVICES ; FABRICATION ; CHIPS
WOS研究方向	Chemistry ; Food Science & Technology ; Spectroscopy
语种	英语
出版者	ROYAL SOC CHEMISTRY
WOS记录号	WOS:000459906000009
资助机构	Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Sciences
内容类型	期刊论文
源URL	[http://ir.hfcas.ac.cn:8080/handle/334002/42248]
专题	合肥物质科学研究院_中科院固体物理研究所
通讯作者	You, Hui
作者单位	1.Chinese Acad Sci, Inst Intelligent Machines, Hefei 230031, Anhui, Peoples R China 2.Univ Sci & Technol China, Hefei 230026, Anhui, Peoples R China
推荐引用方式 GB/T 7714	Chang, Yongjia,You, Hui. A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis[J]. ANALYTICAL METHODS,2019,11(9):1229-1236.
APA	Chang, Yongjia,&You, Hui.(2019).A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis.ANALYTICAL METHODS,11(9),1229-1236.
MLA	Chang, Yongjia,et al."A hybrid adhesive bonding of PMMA and PCB with an application on microchip electrophoresis".ANALYTICAL METHODS 11.9(2019):1229-1236.