In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device

doi:10.1016/j.ultramic.2018.12.008

	In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device
	Yang, Yang; Fu, Zhengqian; Zhang, Xiao; Cui, Yan; Xu, Fangfang; Li, Tie; Wang, Yuelin
刊名	ULTRAMICROSCOPY
	2019-03-01
卷号	198 页码:43
关键词	Double-tilt in situ TEM Tensile testing Mechanical characterization
ISSN号	0304-3991
DOI	10.1016/j.ultramic.2018.12.008
文献子类	Article
英文摘要	This research is aimed at the development of an in situ tensile device which is suitable for standard double-tilt electrical TEM holders. The device contains a hexagonal electrostatic chip with a diameter of 1.8 mm. The chip has 706 pairs of combs, which provides an effective tensile displacement larger than 1 mu m To demonstrate the device performance, in situ tensile testing for penta-twinned silver nanowire is conducted in a high-resolution TEM. Experimental results show that the device can fulfill a flit angle of 10 degrees around both X and Y axes when performing in situ tensile testing experiments. The implemented tensile device has potential applications to characterize the deformation behavior of individual nanostructure in situ TEM at atomic lattice resolution level.
WOS研究方向	Microscopy
语种	英语
出版者	ELSEVIER SCIENCE BV
内容类型	期刊论文
源URL	[http://ir.sic.ac.cn/handle/331005/27316]
专题	中国科学院上海硅酸盐研究所
推荐引用方式 GB/T 7714	Yang, Yang,Fu, Zhengqian,Zhang, Xiao,et al. In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device[J]. ULTRAMICROSCOPY,2019,198:43.
APA	Yang, Yang.,Fu, Zhengqian.,Zhang, Xiao.,Cui, Yan.,Xu, Fangfang.,...&Wang, Yuelin.(2019).In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device.ULTRAMICROSCOPY,198,43.
MLA	Yang, Yang,et al."In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device".ULTRAMICROSCOPY 198(2019):43.