Thermoelectric interface materials: A perspective to the challenge of thermoelectric power generation module
Liu, Weishu; Bai, Shengqiang
刊名JOURNAL OF MATERIOMICS
2019-09-01
卷号5期号:3页码:321
关键词Thermoelectric power generation Thermoelectric interface materials Bonding strength Interfacial resistance Stability
ISSN号2352-8478
DOI10.1016/j.jmat.2019.04.004
文献子类Article
英文摘要The past years has observed a significantly boost of the thermoelectric materials in the scale of thermoelectric figure-of-merit, i.e. ZT, because of its promising application to harvest the widely distributed waste heat. However, the simplified thermoelectric materials' performance scale also shifted the focus of thermoelectric energy conversion technique from devices-related efforts to materials-level works. As a result, the thermoelectric devices-related works didn't get enough attention. The device-level challenges behind were kept unknown until recent years. However, besides the thermoelectric materials properties, the practical energy conversion efficiency and service life of thermoelectric device is highly determined by assembling process and the contact interface. In this perspective, we are trying to shine some light on the device-level challenge, and give a special focus on the thermoelectric interface materials (TEiM) between the thermoelectric elements and electrode, which is also known as the metallization layer or solder barrier layer. We will go through the technique concerns that determine the scope of the TEiM, including bonding strength, interfacial resistance and stability. Some general working principles are summarized before the discussion of some typical examples of searching proper TEiM for a given thermoelectric conversion material. (C) 2019 The Chinese Ceramic Society. Production and hosting by Elsevier B.V.
WOS研究方向Chemistry ; Materials Science ; Physics
语种英语
出版者ELSEVIER
内容类型期刊论文
源URL[http://ir.sic.ac.cn/handle/331005/26865]  
专题中国科学院上海硅酸盐研究所
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Liu, Weishu,Bai, Shengqiang. Thermoelectric interface materials: A perspective to the challenge of thermoelectric power generation module[J]. JOURNAL OF MATERIOMICS,2019,5(3):321.
APA Liu, Weishu,&Bai, Shengqiang.(2019).Thermoelectric interface materials: A perspective to the challenge of thermoelectric power generation module.JOURNAL OF MATERIOMICS,5(3),321.
MLA Liu, Weishu,et al."Thermoelectric interface materials: A perspective to the challenge of thermoelectric power generation module".JOURNAL OF MATERIOMICS 5.3(2019):321.
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