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	Semiconductor laser device
	TANAKA HARUO
	1992-01-30
著作权人	ローム株式会社
专利号	JP1992028282A
国家	日本
文献子类	发明申请
其他题名	Semiconductor laser device
英文摘要	PURPOSE:To improve a semiconductor laser device in heat dissipating property by a method wherein a plate is fixed to the upper peripheral part of a first stem, and the lower circumference of a cap is fixed to the plate concerned. CONSTITUTION:A stem 11 is formed of a clad material composed of a carbon steel plate 11a'' joined to the upside of a copper plate 11a' in one piece and into a two-layered structure composed of stems 11a and 11b. A U-shaped cut line is provided onto the stem 11b by carving, and a part inside the cut line is bent toward a cap 15 to form a block 12. Lead terminals 17b and 17c are connected to the underside of the stem 11b, and through-holes 20 are bored in the stem 11b, and the terminals 17b and 17c are inserted into the through- holes 20 respectively. Then, an insulating sealing material 18 is filled into the through-holes 20 respectively, and the terminals 17b and 17c are fixed to the stem 11c in a hermetically sealed state. Furthermore, the stems 11a and 11b are fixed through all their peripheries, and a semiconductor laser chip is bonded to the side face of the block 12. By this setup, the stem 11a is formed of metal excellent in thermal conductivity, and the plate 11a'' is fixed to the outer periphery, so that a semiconductor laser device of this design can be improved in heat dissipating property.
公开日期	1992-01-30
申请日期	1990-05-23
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/71008]
专题	半导体激光器专利数据库
作者单位	ローム株式会社
推荐引用方式 GB/T 7714	TANAKA HARUO. Semiconductor laser device. JP1992028282A. 1992-01-30.

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