Chip carrier
YAMASHITA JUNICHIRO; MIYAKE YOSHIO; TAKEI TOSHIO
1986-08-16
著作权人MITSUBISHI ELECTRIC CORP
专利号JP1986183978A
国家日本
文献子类发明申请
其他题名Chip carrier
英文摘要PURPOSE:To prevent the deterioration in quality caused by the solder heat of a light emitting element or the axial shift of an optical fiber after soldering by a method wherein the part holding the optical fiber is composed of heat insulator. CONSTITUTION:In the fusion state of solder 7, while an optical fiber 6 is moved, the coupling degree of the radiated light out of a light emitting element 5 with it is monitored. In the state of holding the fiber 6 at a position where the coupling degree becomes maximum, the solder 7 is solidified by cooling. In this case, a heat insulator 3A is exposed to solder heat for its fusion; however, this heat is shielded by the heat insulator 3A and does not transmit to the joint of a chip carrier 1A. This prevents the light emitting element 5 on a mount 2 of the chip carrier 1A from exposure to the solder heat. Since the temperature variation of the joint 4 as the carrier 1A main body reduces, the distorsion of this main body after cooling solidification of the solder 7 hardly generates.
公开日期1986-08-16
申请日期1985-02-12
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/70623]  
专题半导体激光器专利数据库
作者单位MITSUBISHI ELECTRIC CORP
推荐引用方式
GB/T 7714
YAMASHITA JUNICHIRO,MIYAKE YOSHIO,TAKEI TOSHIO. Chip carrier. JP1986183978A. 1986-08-16.
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