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	Manufacture of semiconductor laser
	MITA ARIO
	1986-05-06
著作权人	SONY CORP
专利号	JP1986088588A
国家	日本
文献子类	发明申请
其他题名	Manufacture of semiconductor laser
英文摘要	PURPOSE:To bond semiconductor laser chips simultaneously with a large number of light-receiving elements by bonding the semiconductor laser chips to laser chip connecting sections in each element forming region to a wafer-shaped semiconductor substrate. CONSTITUTION:Photodiodes 3 are formed in several element forming region 2 in a semiconductor substrate 1, and solder layers 4 are shaped to laser chip connecting sections in each region 2. Grooves 9 are shaped along substrate- latticed half dicing lines 8 from the surface in the substrate Semiconductor laser chips 10 are positioned onto the layers 4 in respective region 2, and the chips 10 are bonded with the laser chip connecting sections in the substrate 1 through the layers 4 through heating. The substrate 1 is broken by the groove 9 and divided into several pellet 1 According to said manufacture, the semiconductor laser chips can be bonded with a large number of light-receiving elements shaped to one wafer at the same time. Consequently, the chips can be bonded extremely simply.
公开日期	1986-05-06
申请日期	1984-10-08
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/70591]
专题	半导体激光器专利数据库
作者单位	SONY CORP
推荐引用方式 GB/T 7714	MITA ARIO. Manufacture of semiconductor laser. JP1986088588A. 1986-05-06.

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