Flip-chip mounted optical device
JAN ISAKSSON
2002-08-28
著作权人MITEL SEMICONDUCTOR AB
专利号GB2372633A
国家英国
文献子类发明申请
其他题名Flip-chip mounted optical device
英文摘要A method of making an active optical device for coupling to optical fibres, which allows driver chips to be closely mounted to optical components. Arrays of contacts are formed on the rear face of a substrate, which is transparent or has a hole to provide a light path. A light emitter such as a VCSEL, or a light receiver such as a PIN diode is flip-chip bonded onto the substrate in a precise location determined by the array of contacts using solder alignment, and is optically coupled through the substrate to an external light guide on the front face of the substrate. A guide frame for positioning the light guide is provided, and a heat sink may be bonded to the rear of the substrate.
公开日期2002-08-28
申请日期2001-02-24
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/65398]  
专题半导体激光器专利数据库
作者单位MITEL SEMICONDUCTOR AB
推荐引用方式
GB/T 7714
JAN ISAKSSON. Flip-chip mounted optical device. GB2372633A. 2002-08-28.
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