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	Manufacture of airtight terminal for optical semiconductor device
	NAKAMURA KOJI
	1989-04-26
著作权人	NEC KANSAI LTD
专利号	JP1989108790A
国家	日本
文献子类	发明申请
其他题名	Manufacture of airtight terminal for optical semiconductor device
英文摘要	PURPOSE:To improve accuracy by simultaneously conducting block correction for positioning a light-emitting element mount surface of a heat sink and flattening machining of a wire bonding surface at the upper tip of a lead. CONSTITUTION:A heat sink 5 is brazed to a stem 1 sealed with glass, block correction for positioning a light-emitting element mount-surface 5a in the heat sink 5 and the flattening machining of a wire bonding surface 2a at the upper tip of a lead 3 are executed simultaneously, and the light-emitting mount-surface 5a in the heat sink 5 and the wire bonding surface 2a in the lead 2 are shaped in specified positional relationship. Accordingly, processes are decreased and processing cost is reduced while an airtight terminal, bonding of which is automated excellently and which has superior mount ing properties and high accuracy, can be manufactured.
公开日期	1989-04-26
申请日期	1987-10-21
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/63112]
专题	半导体激光器专利数据库
作者单位	NEC KANSAI LTD
推荐引用方式 GB/T 7714	NAKAMURA KOJI. Manufacture of airtight terminal for optical semiconductor device. JP1989108790A. 1989-04-26.

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