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	Bonding apparatus
	TAMAI KOICHI; ENDO MOTOYOSHI
	1987-09-28
著作权人	TOSHIBA CORP
专利号	JP1987219930A
国家	日本
文献子类	发明申请
其他题名	Bonding apparatus
英文摘要	PURPOSE:To reduce the number of use of an insulating material, to increase a thermal efficiency and thereby to improve productivity, by a construction wherein either of a holder of a capillary and a stem having a bonding face and positioned on a heating stand is provided with an electroconductive contactor which contacts with either of the holder and the stem. CONSTITUTION:Differently from conventional ones, a holder 28 is provided with an electroconductive contactor 29 on the opposite sides of a capillary 22 so that the fore end of the contactor faces the upper surface of a stem 12 operating as an opposite part. When the entire holder 28 is lowered by a driving arm 24, first the contactor 29, out of the capillary 22 and the contactor 29 provided in the holder 28, contacts, at the fore end, with the upper surface of the stem 12. By this contact, the potential balance between the holder 28 side and the stem 12 side is gained at a position near a chip 1 Therefore, no surge voltage is impressed on the chip 11 even when the chip 11 comes in contact with a bonding face 12a on the stem 12 with the continuation of the lowering of the holder 28. In this state, the stem 12 is heated by a heating stand 27, a low-melting metal evaporated on the bonding face 12a is melted, so as to weld the chip 1
公开日期	1987-09-28
申请日期	1986-03-20
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/63019]
专题	半导体激光器专利数据库
作者单位	TOSHIBA CORP
推荐引用方式 GB/T 7714	TAMAI KOICHI,ENDO MOTOYOSHI. Bonding apparatus. JP1987219930A. 1987-09-28.

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