Laser processing method and device
MIZOGUCHI YUYA; ISHIGURO HIROAKI; ITO RYOHEI; KOBAYASHI RYO; MASUDA KENJI
2019-04-11
著作权人AMADA HOLDINGS CO.,LTD.
专利号WO2019070055A1
国家世界知识产权组织
文献子类发明申请
其他题名Laser processing method and device
英文摘要A laser processing method, in which: laser light from a fiber laser or a direct diode laser is radiated from a nozzle to an iron plate material; a nozzle having a nozzle opening part of an opening diameter set in advance in accordance with the thickness of the plate material is selected from a plurality of nozzles each having a nozzle opening part of different opening diameters, and used; an assist gas is discharged from the nozzle opening part towards the plate material while the laser light is radiated at the plate material; and the plate material is cut.
公开日期2019-04-11
申请日期2018-10-05
状态未确认
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/59221]  
专题半导体激光器专利数据库
作者单位AMADA HOLDINGS CO.,LTD.
推荐引用方式
GB/T 7714
MIZOGUCHI YUYA,ISHIGURO HIROAKI,ITO RYOHEI,et al. Laser processing method and device. WO2019070055A1. 2019-04-11.
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