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	Laser thermal processing with laser diode radiation
	TALWAR, SOMIT; MARKLE, DAVID A.
	2009-04-16
著作权人	ULTRATECH, INC.
专利号	US20090095724A1
国家	美国
文献子类	发明申请
其他题名	Laser thermal processing with laser diode radiation
英文摘要	A method and apparatus for performing laser thermal processing (LTP) using one or more two-dimensional arrays of laser diodes and corresponding one or more LTP optical systems to form corresponding one or more line images. The line images are scanned across a substrate, e.g., by moving the substrate relative to the one or more line images. The apparatus also includes one or more recycling optical systems arranged to re-image reflected annealing radiation back onto the substrate. The use of one or more recycling optical systems greatly improves the heating efficiency and uniformity during LTP.
公开日期	2009-04-16
申请日期	2008-12-09
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/58364]
专题	半导体激光器专利数据库
作者单位	ULTRATECH, INC.
推荐引用方式 GB/T 7714	TALWAR, SOMIT,MARKLE, DAVID A.. Laser thermal processing with laser diode radiation. US20090095724A1. 2009-04-16.

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