| Multilevel template assisted wafer bonding | |
| KRASULICK, STEPHEN B.; CREAZZO, TIMOTHY; MARCHENA, ELTON; DALLESASSE, JOHN | |
| 2018-10-25 | |
| 著作权人 | SKORPIOS TECHNOLOGIES, INC. |
| 专利号 | US20180308834A1 |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Multilevel template assisted wafer bonding |
| 英文摘要 | Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure. |
| 公开日期 | 2018-10-25 |
| 申请日期 | 2018-02-20 |
| 状态 | 申请中 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57699]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SKORPIOS TECHNOLOGIES, INC. |
| 推荐引用方式 GB/T 7714 | KRASULICK, STEPHEN B.,CREAZZO, TIMOTHY,MARCHENA, ELTON,et al. Multilevel template assisted wafer bonding. US20180308834A1. 2018-10-25. |
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