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	Optical interconnection assemblies, glass interconnection substrates, and methods of making an optical connection
	FLORIAN LOHSE, CHENUEH ABONGWA; SUTHERLAND, JAMES SCOTT
	2018-08-30
著作权人	CORNING OPTICAL COMMUNICATIONS LLC
专利号	US20180246279A1
国家	美国
文献子类	发明申请
其他题名	Optical interconnection assemblies, glass interconnection substrates, and methods of making an optical connection
英文摘要	Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion.
公开日期	2018-08-30
申请日期	2018-02-19
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54860]
专题	半导体激光器专利数据库
作者单位	CORNING OPTICAL COMMUNICATIONS LLC
推荐引用方式 GB/T 7714	FLORIAN LOHSE, CHENUEH ABONGWA,SUTHERLAND, JAMES SCOTT. Optical interconnection assemblies, glass interconnection substrates, and methods of making an optical connection. US20180246279A1. 2018-08-30.

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