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	High-power amplifier package
	GITTEMEIER, TIMOTHY
	2017-11-23
著作权人	MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
专利号	WO2017200561A1
国家	世界知识产权组织
文献子类	发明申请
其他题名	High-power amplifier package
英文摘要	Package assemblies for improving heat dissipation of high-power components in microwave circuits are described. A laminate that includes microwave circuitry may have cut-outs that allow high-power components to be mounted directly on a heat slug below the laminate. Electrical connections to circuitry on the laminate may be made with wire bonds. The packaging allows more flexible design and tuning of packaged microwave circuitry.
公开日期	2017-11-23
申请日期	2016-09-01
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54724]
专题	半导体激光器专利数据库
作者单位	MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
推荐引用方式 GB/T 7714	GITTEMEIER, TIMOTHY. High-power amplifier package. WO2017200561A1. 2017-11-23.

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