Curable Silicone Resin Composition, Cured Object Obtained Therefrom, and Optical Semiconductor Device Formed Using Same
KAWAI, WATARU; AKIYAMA, KATSUHIRO; MATSUNO, YU; NAKATSUJI, JUNYA; SEINO, MAKOTO
2017-08-03
著作权人CENTRAL GLASS COMPANY, LIMITED
专利号US20170218128A1
国家美国
文献子类发明申请
其他题名Curable Silicone Resin Composition, Cured Object Obtained Therefrom, and Optical Semiconductor Device Formed Using Same
英文摘要A curable silicone resin composition according to the present invention includes at least the following components: (A) a silicone resin having a hydrogen atom bonded to silicon atom (as SiH group); (B) a silicone resin having a vinyl group bonded to silicon atom (as Si—CH═CH2 group); and (C) a platinum catalyst, wherein the total amount of silanol (Si—OH) group in the components (A) and (B) is 0.5 to 5.0 mmol/g; and wherein the amount of platinum in the component (C) relative to the total mass of the components (A), (B) and (C) is 0.003 to 3.0 ppm in mass units. A cured product obtained by heating the composition is suitably usable as an encapsulant of an optical semiconductor device.
公开日期2017-08-03
申请日期2015-07-10
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/54601]  
专题半导体激光器专利数据库
作者单位CENTRAL GLASS COMPANY, LIMITED
推荐引用方式
GB/T 7714
KAWAI, WATARU,AKIYAMA, KATSUHIRO,MATSUNO, YU,et al. Curable Silicone Resin Composition, Cured Object Obtained Therefrom, and Optical Semiconductor Device Formed Using Same. US20170218128A1. 2017-08-03.
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