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	Mounting block and a mounting assembly that incorporates the mounting block
	ENGEL, ANDREW C.; BROSNAN, MICHAEL J.; MEADOWCROFT, DAVID J.K.; GIESSLER, KLAUS D.; YU, PAUL
	2015-12-24
著作权人	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
专利号	US20150373834A1
国家	美国
文献子类	发明申请
其他题名	Mounting block and a mounting assembly that incorporates the mounting block
英文摘要	A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short.
公开日期	2015-12-24
申请日期	2014-06-19
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54515]
专题	半导体激光器专利数据库
作者单位	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
推荐引用方式 GB/T 7714	ENGEL, ANDREW C.,BROSNAN, MICHAEL J.,MEADOWCROFT, DAVID J.K.,et al. Mounting block and a mounting assembly that incorporates the mounting block. US20150373834A1. 2015-12-24.

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