Thermal management in electronic devices with yielding substrates
TISCHLER, MICHAEL, A.
2014-12-24
著作权人COOLEDGE LIGHTING INC.
专利号WO2014140811A3
国家世界知识产权组织
文献子类发明申请
其他题名Thermal management in electronic devices with yielding substrates
英文摘要In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
公开日期2014-12-24
申请日期2014-03-14
状态未确认
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/54502]  
专题半导体激光器专利数据库
作者单位COOLEDGE LIGHTING INC.
推荐引用方式
GB/T 7714
TISCHLER, MICHAEL, A.. Thermal management in electronic devices with yielding substrates. WO2014140811A3. 2014-12-24.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace