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	High thermal conductivity and low degradation die attach with dual adhesive
	NG, KEAT CHUAN; CHAN, BIT TIE; TAN, KHENG LENG
	2013-03-14
著作权人	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
专利号	US20130062655A1
国家	美国
文献子类	发明申请
其他题名	High thermal conductivity and low degradation die attach with dual adhesive
英文摘要	A package for a light source, a semiconductor device, and methods of manufacturing the same are disclosed. In particular, a Light Emitting Diode (LED) dice is attached to a bonding pad of the light source package by two discrete types of different adhesives. One of the adhesives may be curable under exposure to Ultraviolet (UV) light and the other adhesive may be cured under thermal radiation, but is stable when exposed to UV light.
公开日期	2013-03-14
申请日期	2011-09-09
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54265]
专题	半导体激光器专利数据库
作者单位	AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
推荐引用方式 GB/T 7714	NG, KEAT CHUAN,CHAN, BIT TIE,TAN, KHENG LENG. High thermal conductivity and low degradation die attach with dual adhesive. US20130062655A1. 2013-03-14.

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