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	Embedded metal heat sink for semiconductor
	SU, YAN-KUIN; CHEN, KUAN-CHUN; LIN, CHUN-LIANG; HUANG, JIN-QUAN; HU, SHU-KAI
	2008-10-09
著作权人	NATIONAL CHENG KUNG UNIVERSITY
专利号	US20080246143A1
国家	美国
文献子类	发明申请
其他题名	Embedded metal heat sink for semiconductor
英文摘要	An embedded metal heat sink for a semiconductor device is described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.
公开日期	2008-10-09
申请日期	2008-06-10
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54027]
专题	半导体激光器专利数据库
作者单位	NATIONAL CHENG KUNG UNIVERSITY
推荐引用方式 GB/T 7714	SU, YAN-KUIN,CHEN, KUAN-CHUN,LIN, CHUN-LIANG,et al. Embedded metal heat sink for semiconductor. US20080246143A1. 2008-10-09.

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