Laser diode stack utilizing a non-conductive submount
DEFRANZA, MARK JOSEPH; DAWSON, DAVID CLIFFORD; FARMER, JASON NATHANIEL
2007-09-20
著作权人NLIGHT PHOTONICS CORPORATION
专利号US20070217471A1
国家美国
文献子类发明申请
其他题名Laser diode stack utilizing a non-conductive submount
英文摘要A laser diode package is provided, the package including a plurality of laser diode submount assemblies. Each laser diode submount assembly includes a submount comprised of a non-conductive material. At least one laser diode is attached to a first portion of one surface of each submount while a spacer is attached to a second portion of the same submount surface. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. The individual laser diodes of the fabricated stack can be serially coupled together, coupled together in parallel, or individually addressable. To provide package cooling, the laser diode stack is thermally coupled to a cooling block.
公开日期2007-09-20
申请日期2006-07-24
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/53824]  
专题半导体激光器专利数据库
作者单位NLIGHT PHOTONICS CORPORATION
推荐引用方式
GB/T 7714
DEFRANZA, MARK JOSEPH,DAWSON, DAVID CLIFFORD,FARMER, JASON NATHANIEL. Laser diode stack utilizing a non-conductive submount. US20070217471A1. 2007-09-20.
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