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	Thermal interposer for cooled electrical packages
	CORONATI, JOHN M.; DERKITS, GUSTAV EDWARD JR.; DAUGHERTY, DAVID; FUCHS, CHRISTOPHER; GEARY, JOHN M.; LISCHNER, DAVID J.
	2006-01-12
著作权人	CORONATI JOHN M
专利号	US20060006526A1
国家	美国
文献子类	发明申请
其他题名	Thermal interposer for cooled electrical packages
英文摘要	The specification describes electrical assemblies comprising actively cooled components wherein a thermal interposer is used to limit heat transfer between the ambient and the cooled components. The thermal interposer is effective for transmitting signals for both power/ground and RF. Structurally, the thermal interposer comprises thin conductors in various configurations that convey electrical signals but significantly limit heat flow.
公开日期	2006-01-12
申请日期	2004-07-06
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53372]
专题	半导体激光器专利数据库
作者单位	CORONATI JOHN M
推荐引用方式 GB/T 7714	CORONATI, JOHN M.,DERKITS, GUSTAV EDWARD JR.,DAUGHERTY, DAVID,et al. Thermal interposer for cooled electrical packages. US20060006526A1. 2006-01-12.

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