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	Mounting of a semiconductor laser device by soldering
	SAKANO, TETSURO; TAKIGAWA, HIROSHI; NISHIKAWA, YUJI
	2004-12-15
著作权人	FANUC LTD
专利号	EP1487073A2
国家	欧洲专利局
文献子类	发明申请
其他题名	Mounting of a semiconductor laser device by soldering
英文摘要	A semiconductor laser (3) has emitters (7) that are separated by LD stripes (6). Grooves (2) are formed in a mounting substrate (1) corresponding to both ends of the semiconductor laser (3). On mounting, fillets (9) are formed in the grooves (2) by molten solder, thereby reinforcing the soldering at both ends of the semiconductor laser (3) and enabling uniform bonding strength to be achieved.
公开日期	2004-12-15
申请日期	2004-06-08
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53354]
专题	半导体激光器专利数据库
作者单位	FANUC LTD
推荐引用方式 GB/T 7714	SAKANO, TETSURO,TAKIGAWA, HIROSHI,NISHIKAWA, YUJI. Mounting of a semiconductor laser device by soldering. EP1487073A2. 2004-12-15.

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