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	Method of manufacturing a light emitting semiconductor package
	SILVERBROOK, KIA
	2004-11-04
著作权人	NYTELL SOFTWARE LLC
专利号	US20040219700A1
国家	美国
文献子类	发明申请
其他题名	Method of manufacturing a light emitting semiconductor package
英文摘要	A method of manufacturing a light emitting semiconductor package, the method comprising the steps of: obtaining a semiconductor wafer 252 which includes a plurality of light emitting devices 254 residing on or in a surface of the semiconductor wafer 252; forming at least one first hollow cap 256, each first hollow cap 256 formed to provide: a central portion 260 and first perimeter walls extending from the perimeter edge of the central portion with the free edges of the first perimeter walls adapted to be bonded to the surface of the semiconductor wafer 252 to provide a first cavity; at least one region 258 of the central portion 260 which is substantially transparent or translucent to electromagnetic radiation; bonding the at least one first hollow cap 256 to the semiconductor wafer 252, the central portion overlying at least one of the plurality of light emitting devices 254; and, separating the semiconductor wafer 252 with bonded caps 256 into light emitting semiconductor packages 250.
公开日期	2004-11-04
申请日期	2004-05-26
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53338]
专题	半导体激光器专利数据库
作者单位	NYTELL SOFTWARE LLC
推荐引用方式 GB/T 7714	SILVERBROOK, KIA. Method of manufacturing a light emitting semiconductor package. US20040219700A1. 2004-11-04.

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