Self-contained spray cooling module | |
PATEL, CHANDRAKANT D.; BASH, CULLEN E. | |
2004-03-04 | |
著作权人 | HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
专利号 | US20040040328A1 |
国家 | 美国 |
文献子类 | 发明申请 |
其他题名 | Self-contained spray cooling module |
英文摘要 | A semiconductor chip cooling system having a body that forms an enclosed spray chamber, and having a thermal-transmittance wall configured to conformingly adjoin to a chip, a substrate or printed circuit board carrying one or more chips, or another such heated device. Inkjet-type sprayers are configured to spray cooling fluid on the thermal-transmittance wall to cool the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device without the device either drying or becoming covered by a pool. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers. |
公开日期 | 2004-03-04 |
申请日期 | 2003-09-04 |
状态 | 授权 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/53129] |
专题 | 半导体激光器专利数据库 |
作者单位 | HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
推荐引用方式 GB/T 7714 | PATEL, CHANDRAKANT D.,BASH, CULLEN E.. Self-contained spray cooling module. US20040040328A1. 2004-03-04. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论