Packaging and alignment methods for optical components, and optical apparatus employing same
WAGNER, DAVID K.; GUENTHER, HARALD; BISCHEL, WILLIAM K.; LI, JIM WEIJIAN; MOROZOVA, NINA D.
2003-07-17
著作权人-
专利号US20030133668A1
国家美国
文献子类发明申请
其他题名Packaging and alignment methods for optical components, and optical apparatus employing same
英文摘要Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.
公开日期2003-07-17
申请日期2003-01-03
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/52935]  
专题半导体激光器专利数据库
作者单位-
推荐引用方式
GB/T 7714
WAGNER, DAVID K.,GUENTHER, HARALD,BISCHEL, WILLIAM K.,et al. Packaging and alignment methods for optical components, and optical apparatus employing same. US20030133668A1. 2003-07-17.
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