| Self-separating laser diode assembly and method | |
| LI, PENG-CHIH; TERRY, TODD; LANG, ROBERT | |
| 2002-11-21 | |
| 著作权人 | JDS UNIPHASE CORPORATION |
| 专利号 | US20020172244A1 |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Self-separating laser diode assembly and method |
| 英文摘要 | A laser diode bar is separated into laser diode dice after bonding the laser diode bar to a submount. In one embodiment a GaAs laser diode bar is soldered to a diamond submount with gold-tin solder. The difference in the coefficient of thermal expansion between the submount material and the laser bar material is sufficient to create tensile stress in the laser diode bar and cleave the laser diode bar into dice as the assembly cools from the soldering temperature. Use of an electrically insulating submount material allows the laser diodes to be connected in series. Diamond blanks that are essentially un-metallized submounts are used during assembly to avoid bowing, or "smile", of the laser diode assembly. |
| 公开日期 | 2002-11-21 |
| 申请日期 | 2001-05-17 |
| 状态 | 失效 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/52435]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | JDS UNIPHASE CORPORATION |
| 推荐引用方式 GB/T 7714 | LI, PENG-CHIH,TERRY, TODD,LANG, ROBERT. Self-separating laser diode assembly and method. US20020172244A1. 2002-11-21. |
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